Monday, July 15, 2024

Methods to handle thermomechanical instability of perovskite photo voltaic modules – pv journal International


A US analysis crew is investigating the thermomechanical reliability of metallic halide perovskite (MHP) modules and cells in an effort to determine the very best technique to enhance their stability underneath thermomechanical stressors. The scientists mentioned, particularly, the stresses of the movie, the adhesion of the cost transport layers, and instability underneath mild and warmth.

Scientists from Arizona State University have revealed a paper on fixing mechanical-based failure mechanisms to make metallic halide perovskite (MHP) modules and cells extra sturdy and dependable.

The crew said that the way forward for secure and environment friendly perovskite photo voltaic modules lies in understanding the interconnection between the assorted degradation modes, mechanical, thermal, and chemical, underneath mild, warmth, and humidity stressors.

“We observed that there’s a vital acceleration of failure charges and decreased lifetimes of perovskite photo voltaic modules within the discipline in comparison with these examined within the lab,” the lead writer of the paper, Marco Casareto, stated. pv journal. “Specifically, there’s little work on check modules underneath many environmental stressors, equivalent to each mild and thermal modifications. We need to focus consideration on this necessary space of ​​analysis within the hope which is able to facilitate the event and business viability of MHPs.

“Yes, and we consider these elements are related, based mostly on a shared underlying mechanism associated to the mechanical properties of an MHP module,” stated analysis affiliate Nick Rolston. pv journal.

Their paper highlights points associated to low fracture power (Gc) of fabric layers and interlayer bonding. “Gc is a cloth’s resistance to the propagation of a crack, relying on the fabric/interface bonding power and the power of a cloth to deform,” defined the analysis crew.

In addition, it discusses the unfavorable impact of movie stresses throughout the perovskite absorber, how scribing removes the fabric introducing extra interfaces for stress, and the significance of practical accelerated degradation testing of lab.

Realistic testing of instruments with a number of simultaneous stressors is “important” to simulate discipline operation and obtain business maturity, the crew emphasised. It suggests setting a minimal Mrc at 1 J/m2 for lab instruments to make sure that modules can face up to processing and packaging steps with out mechanical failure, in addition to lowering the potential for delamination and speedy deterioration.

The researchers counsel that “engineering compressive stress” and “tuning layer properties” can enhance thermomechanical reliability. They additionally describe encapsulant and perovskite photo voltaic module (PSM) materials methods to extend hardness.

Their findings seem in “Designing metallic halide perovskite photo voltaic modules for thermomechanical reliability,” revealed in communication supplies.

When requested about reactions to the publication, Rolston stated, “We have not had a lot suggestions because the paper was simply launched; nonetheless, we mentioned these outcomes with among the MHP startups working in direction of the commercialization of the know-how, in addition to the Perovskite PV Accelerator for Commercializing Technologies (PACT),” referring to the multi-year US Department of Energy’s PACT accelerator, led by Sandia National Laboratories.

There continues to be a protracted technique to go, as Rolston sees it, however there’s optimism concerning the improvement of MHP PV panels with operation occasions corresponding to incumbent silicon or cadmium telluride (CdTe), if extra effort is made to design for thermomechanical. reliability, quite than simply for efficiency.

Looking forward, Casareto stated, “We are presently engaged on validating our speculation of a mechanical failure mechanism. This contains making MHP particular person cells with out writing or encapsulation to determine a baseline of how they degrade underneath thermal biking as soon as encapsulated. We are additionally doing the identical with modules shortly to make clear any variations in degradation mechanisms/severity. of modules underneath thermal biking. We intend to look at the impact of encapsulation, particularly on scribe strains, as a thermally cycled module to find out which properties are most necessary/helpful for a PSM encapsulant.

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